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The procurement involves a Blanket Ordering Agreement (BOA) for printed circuit boards. This is intended for use by federal agencies requiring electronic components. Key requirements include compliance with specified technical standards and delivery timelines.
The work involves the production and delivery of printed circuit boards as per the specifications outlined in the agreement.
This listing does not include downloadable attachments. The solicitation details may be in the description below.
Verify on SAM.govhttps://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=f6db78483dc14ed4913314252cd83e79
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