Secure Enclave Chiplets Microelectronics Solutions

This BAA Call is intended to be as streamlined as possible to allow for the exploration of modern microelectronics solutions to support a variety of critical national security systems using the USG and Intel’s Secure Enclave capability. This Call will consist of two steps: 1. A White Paper phase and 2. A Full Proposal phase. Under this two-step approach, submission and governmental evaluation of White Papers is required before invited offerors can submit a Full Proposal. The White Paper will be utilized to screen the Offeror’s proposed approach (in advance of a Full Proposal invitation), which helps to streamline the down-select process and strike a fair balance between an Offeror’s bid and proposal resources and the Government’s evaluation

requirements. Offerors submitting White Papers may be invited to submit a full technical and cost proposal of their White Paper submission. This invitation may encompass the Offeror’s entire White Paper submission or be limited to a specific portion, component or phase of the proposed effort. Any such invitation does not constitute a commitment, promise, or obligation on the part of the Government to award a contract or Other Transaction agreement. An offeror that does NOT submit a timely and compliant White Paper is NOT eligible (and thus cannot be invited) to submit a Full Proposal for consideration for an award.