Compact Cold-Atom Devices and Ultra-High Quality Factor Microdevices

The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals that enable compact cold-atom devices and environmentally-decoupled ultra-high Q microelectromechanical (MEMS) and photonics devices through microscale ultra-high-vacuum systems (µUHV). Perrseus PS Coordinator Contracting (No Street Address

2) ARLINGTON, VA 222032114 USA to this opportunity. DARPA-PS-26-127.pdf SAMPLE_OT_P__-_Streamlined__Fixed_-_2025.02.28.docx SAMPLE_OT_P__-_Fixed_Support_Traditional_Cost-Share_-_2025.02.28.docx SAMPLE_OT_P__-_Fixed_Support_Nontraditional_-_2025.02.28.docx SAMPLE_OT_P__-_Expenditure_Based_Approach_-_2025.02.28.docx SAMPLE_OT_P__-_Cost-Share_Expenditure_Based_-_2025.02.28.docx DARPA-PS-26-127_Perrseus_Attachment_E_Proposal_Instructions_and_Volume_II_Template_Price.docx DARPA-PS-26-127_Perrseus_Attachment_I_Schedule_of_Milestones_and_Payments.docx DARPA-PS-26-127_Perrseus_Attachment_H_Task_Description_Document_TDD_Template.docx DARPA-PS-26-127_Perrseus_Attachment_G_Other_Transaction_Certifications.docx DARPA-PS-26-127_Perrseus_Attachment_F_Price_Detail_Spreadsheet.xlsx DARPA-PS-26-127_Perrseus_Attachment_K_Proposer_Checklist.docx DARPA-PS-26-127_Perrseus_Attachment_D_Proposal_Instructions_and_Volume_I_Template_Technical_and_Management_v1.docx DARPA-PS-26-127_Perrseus_Attachment_M_DARPA_BAAT_Submission_Portal_Guide.docx DARPA-PS-26-127_Perrseus_Attachment_L_Perrseus_CUI_Guide.pdf DARPA-PS-26-127_Perrseus_Attachment_J_Model_OT_Prototype.docx DARPA-PS-26-127_Perrseus_Attachment_C_Proposal_Summary_Slide_Template.pptx DARPA-PS-26-127_Perrseus_Attachment_B_Abstract_Instructions_and_Template.docx DARPA-PS-26-127_Perrseus_Attachment_A_Abstract_Summary_Slide_Template.pptx