Rapid Long-Term Semiconductor Foundry Access Support

The Defense Microelectronics Activity (DMEA), McClellan, CA is issuing this Sources Sought Notice to find potential sources to provide rapid, long-term assured semiconductor foundry access. Industry responses to this Notice will assist the Government in determining the appropriate acquisition method, and will provide the Government information about the availability of qualified companies technically capable of meeting the requirement. Information received in response to this Notice will also help the Government determine: How many potential IDIQ contracts the Government may need to issue to cover the range of services contained in this requirement; and Determine structure, phrasing and formatting of contract

requirements and documents; All businesses are invited to respond to this Notice. This Notice is relative to the North American Industry System (NAICS) 334413, Semiconductor and Related Device Manufacturing. The Small Business size standard for NAICS 334413 is 1250 employees. The anticipated (PSC) is R425, Support- Professional: Engineering/Technical. The purpose of the Rapid Assured Access (R2A) program is to provide rapid, long-term assured semiconductor foundry access, regardless of project size and , through enterprise-wide contracts executed by TAPO for DoW programs and defense contractors. TAPO will establish a R2A contract vehicle that provides rapid access to microelectronics manufacturers and an on-ramp of additional vendors, through that vehicle, as required to mitigate future technology gaps.

Objectives Under R2A, and in alignment with the Department of War’s Acquisition Transformation Strategy, TAPO will prioritize three overarching outcomes: 1. Rapidly deploy technology and modernize systems cost-effectively to outpace our adversaries. 2. Increase production capacity and deliver wartime surge capacity for key capabilities, systems, weapons, and munitions to the U.S. Warfighter and priority allies and partners. 3. Secure our nation’s future by reinventing the semiconductor acquisition system to prioritize speed, execution, and agility to resolve current strategic challenges R2A is an acquisition approach to meet the

requirements of the DoW for rapid access to capabilities across the entire spectrum of wafer manufacturing and related services. These capabilities include mask data prep functions, masks sourcing, wafer fabrication, and other ancillary aspects adjacent to wafer fabrication (e.g., packaging, assembly, test, etc.). The scope of R2A covers both prototype development and production. A key

objective of R2A is for the awardees to provide foundry access to Defense contractors (the Defense Industrial Base (DIB)) and program offices via this contract vehicle. The intent is for the awardees to leverage this vehicle as a means to rapidly provide TAPO clients with a quick-turn contract vehicle that has pre-negotiated terms and conditions. Negotiating a long-term contract with TAPO once saves the Government and the awardee time and effort by avoiding repeated negotiations over terms and conditions for each procurement. Forward wafer and other

pricing shall be provided for clients who require use of the vehicle and can be refreshed at pre-determined junctures (1-2 years typically). The intent of R2A is to work directly with the wafer manufacturing foundry supporting fabless design suppliers. A wafer manufacturing foundry is a production qualified wafer fab that consists of Front End of Line (FEOL) and Back End of Line (BEOL) manufacturing steps commonly referred to as lithography, diffusion, chemical vapor deposition, etch, and other associated processes. DMEA/TAPO will not be the primary user of this vehicle but rather a service provider that administers the contract vehicle. Specific Information being Sought: Vendors having the ability to provide the