Flooring Tile Epoxy Application Services
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The Department of Defense is procuring flooring tile epoxy application services for the Defense Information Systems Agency at the LetterKenny Army Depot in Chambersburg, PA. The work involves applying epoxy on approximately 900 square feet of break room floor, requiring materials that are abrasion, slip, and stain resistant. This project is set aside for small businesses and includes specific labor categories and compliance with the Performance Work Statement.
Scope & Requirements
The project involves the application of epoxy flooring in a break room, ensuring the material meets specific durability and resistance standards.
Contract Details
- Contract Typei
- FFP
- Estimated Value
- Not specifiedSimilar contracts award $62 to $667 (median $202, 55,295 awards)
- NAICS Codes
- Place of Performance
- Chambersburg, PA, USA
- Set-Asides
- SB
Qualifications & Eligibility
- Set-Aside Category
- Total Small Business Set-Aside
Agency & Contact
Contracting Organization
- Agency
- DEPT OF DEFENSE
- Sub-Agency
- Defense Information Systems Agency
Point of Contact
Key Dates
Description
Application of epoxy on break room floor at DISA facility located at LetterKenny Army Depot in Chambersburg, PA. The application services including labor are in accordance with PWS within the attached solicitation. See SCA WD 2015-4245 revision 31 for York County, PA attached to this solicitation. The labor category that applies is 23760 Painter, Maintenance. Approximately 900 Square Feet of Polymer Resin Tiling. This polymer resin must have the following salient characteristics: abrasion, slip, and stain resistant to standup to spills, scratches, and other accidents that may occur in the break room. The government is issuing amendment one to extend the solicitation due date in accordance with multiple contractor requests. Mark Kraft Alternative
Point of Contact Corey Sandstrom to this opportunity. HC102826R0038001.pdf HC102826R0038.pdf Attachment 2-Break Room Diagram.pdf Attachment 3-CDRL A001.pdf Attachment 4-QASP.docx
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