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DARPA is seeking innovative proposals for the Smash program to develop materials processing technologies for efficient, scalable element separation. The goal is to drive process yield, maximize energy utilization, and ensure scalability.
Develop materials processing technologies for efficient, scalable element separation, focusing on driving process yield, maximizing energy utilization, and ensuring scalability.
The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals around materials processing to enable efficient, scalable element separation across the periodic table. This capability would establish a new technological basis for domestic resource independence.Specifically, the Smash program aims to create technologies that leverage parallel processing to: (1) drive process yield across multiple elements; (2) maximize energy utilization in the intrinsic separation processes; and (3) ensure solutions are scalable across industrial processing operations. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.Note: The referenced Attachment J: Smash Controlled Unclassified Information (CUI) Guide is under final review will be posted subsequently. Smash PA Coordinator Contracting (No Street Address
2) ARLINGTON, VA 222032114 USA
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