Close Fixture for Suss Wafer Bonder

26-10 6640 / 334516 Primary POC: Liz Timberlake ([email protected]) Title: Close Fixture for Suss Wafer Bonder

BACKGROUND

THIS IS A SOURCES SOUGHT NOTICE National Institute of Standards and Technology (NIST) seeks to acquire a universal SiC closed fixture for SUSS Gen2 Wafer Bonder. The SUSS wafer bonder provides a unique function of enabling atomic bonding of two substrates by applying high pressure, high heat or high electric current. This specialty tool currently is not able to support most of bonding processes due to the breakage of its original universal SiC closed fixture. It is essential to replace this fixture in order to enable all functions and support various sizes of samples. Wafer bonding has become a popular and important process among photonic device innovation, semiconductor packaging, quantum device research and new material development. NIST has a need for a universal SiC closed fixture that meets or exceeds the following draft minimum specifications: The Contractor shall provide one (1) universal SiC closed fixture that meet the following minimum specifications: All material shall be new; rebuilt system components will not be considered. This fixture shall be able to transfer and support bonding process for substrates in various shapes and sizes ranged from 10 mm to at least 150 mm. This fixture shall come with proper bonding plates for the following types of bonds: thermocompression, eutectic, adhesion, anodic and fusion bonds. The plate at the center of universal closed fixture shall be made of SiC with the flatness level compatible with Suss wafer bonder operation and is able to resist 20 kN force applied by Suss wafer bonder. The fixture shall include three clamping arms to secure the positions of 100 mm wafer stack. The entire fixture, including clamping arms, shall be able to withstand processing temperature up to 550 ◦C, and chamber overpressure at least 2 bar and vacuum 5.0 x 10E-5 mbar or lower. The installation, setup, and acceptance will take place at the NIST CNST NanoFab cleanroom in Gaithersburg, MD. HOW TO RESPOND TO THIS NOTICE In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORMATION. Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf format, in the response. Submit the response by email to the and, if specified, to the Secondary

Point of Contact listed at the bottom of this notice as soon as possible, and preferably before the closing date and time of this notice. Provide the complete name of your company, address, name of contact for follow-up

questions, their email, their phone number and, if your company has an active registration in https://sam.gov, your company’s Unique Entity ID (UEI). Details about what your company is capable of providing that meets or exceeds NIST’s minimum

requirements. Whether your company is an authorized reseller of the product or service being cited and evidence of such authorization. Identify any aspects of the description of the